© 2015 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 11/04/15

Humidity Aging

+85°C, 85% RH,1000 hours

+/-10% typical voltage change

Thermal Shock

+85°C to -40°C 10 times

+/-10% typical voltage change

Solvent Resistance

MIL–STD–202, Method 215

Moisture Sensitivity

Level 1, J–STD–020

Lead Material

Copper Clad Steel Wire

Soldering

Characteristics

Solderability per MIL–STD–202,

Method 208

Insulating Material

Cured, flame retardant epoxy polymer

meets UL94V–0 requirements

Device Labeling

Marked with LF, voltage and date code

Physical Specifications

Environmental Specifications

Wave Solder Profile

0

50

100

150

200

250

300

00.5

11.5

22.5

33.5

4

TIME(MINUTES)

Maximum Wave 240C

Lead–free Profile

0

50

100

150

200

250

300

00.5

11.5

22.5

33.5

4

TIME(MINUTES)

Maximum Wave 260C

Non Lead–free Profile