PAM8303C

Document number: DSxxxxx Rev. 1 - 2

3 of 17

www.diodes.com

June 2013

© Diodes Incorporated

PAM8303C

A Product Line of

Diodes Incorporated

These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for prolonged time periods may

affect device reliability. All voltages are with respect to ground.

Parameter

Rating

Unit

Supply Voltage

6.0

V

Input Voltage

Maximum Junction Temperature

150

°C

Storage Temperature

-65 to +150

Soldering Temperature

250, 10 sec

Parameter

Rating

Unit

Supply Voltage Range

2.8 to 5.5

V

Ambient Temperature Range

-40 to +85

°C

Junction Temperature Range

-40 to +125

°C

Thermal Information

Parameter

Package

Symbol

Max

Unit

Thermal Resistance (Junction to Ambient)

WCSP 1.45x1.45

90-220

°C/W

MSOP-8

180

DFN3x3-8

47.9

Thermal Resistance (Junction to Case)

MSOP-8

75

Note:

For the 9-pin CSP package, the thermal resistance is highly dependent on the PCB heat sink area.

For example, the

Θ

using ground and power planes, the value is around 90°C/W.