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EM3592-RTR 数据表(PDF) 56 Page - Silicon Laboratories |
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EM3592-RTR 数据表(HTML) 56 Page - Silicon Laboratories |
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56 / 59 page ![]() EM359x 56 Rev 1.0 Table 6.3. PCB Land Pattern Dimension Min C1 7.89 C2 7.89 e 0.50 X1 0.26 Y1 0.84 X2 6.15 Y2 6.15 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-SM-782 guidelines. Solder Mask Design 1. All pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. |
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