6. Packaging

Figure 6.1. TS1105-06 3x3 mm 8-TDFN Package Diagram

Table 6.1. Package Dimensions

Dimension

Min

Nom

Max

A

0.70

0.75

0.80

A1

0.00

0.02

0.05

A2

0.20 REF

b

0.25

0.30

0.35

D

3.00 BSC

D2

1.49

1.50

1.51

e

0.65 BSC

E

3.00 BSC

E2

1.65

1.75

1.85

L

0.30

0.40

0.50

K

0.20

0.25

0.30

J

0.65 REF

aaa

0.10

bbb

0.05

ccc

0.05

Note:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

3. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

4. This drawing conforms to the JEDEC Solid State Outline MO-229.

TS1105/06 Data Sheet

Packaging

silabs.com | Smart. Connected. Energy-friendly.

Rev. 1.0 | 15