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RPC564L60L5BFSR 数据表(PDF) 86 Page - STMicroelectronics |
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RPC564L60L5BFSR 数据表(HTML) 86 Page - STMicroelectronics |
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86 / 137 page  Electrical characteristics RPC56EL60L5 86/137 DocID026934 Rev 1 3.4 Thermal characteristics VSS_HV_AD0 VSS_HV_AD1 SR ADC_0 ground and low reference voltage ADC_1 ground and low reference voltage —0 0 V VSS_HV_ADV SR 3.3 V ADC supply ground — 0 0 V VDD_LV_REGCOR (4) SR Internal supply voltage — — — V VSS_LV_REGCOR (5) SR Internal reference voltage — 0 0 V VDD_LV_CORx 2 SR Internal supply voltage — — — V VSS_LV_CORx 3 SR Internal reference voltage — 0 0 V VDD_LV_PLL 2 SR Internal supply voltage — — — V VSS_LV_PLL 3 SR Internal reference voltage — 0 0 V TA SR Ambient temperature under bias fCPU 120 MHz –40 125 °C TJ SR Junction temperature under bias — –40 150 °C 1. Full functionality cannot be guaranteed when voltage drops below 3.0 V. In particular, ADC electrical characteristics and I/Os DC electrical specification may not be guaranteed. 2. VDD_HV_ADR0 and VDD_HV_ADR1 cannot be operated at different voltages, and need to be supplied by the same voltage source. 3. VDD_HV_ADRx must always be applied and should be stable before LBIST starts. If this supply is not above its absolute minimum level, LBIST operations can fail. 4. Can be connected to emitter of external NPN. Low voltage supplies are not under user control. They are produced by an on- chip voltage regulator. 5. For the device to function properly, the low voltage grounds (VSS_LV_xxx) must be shorted to high voltage grounds (VSS_HV_xxx) and the low voltage supply pins (VDD_LV_xxx) must be connected to the external ballast emitter, if one is used. Table 9. Recommended operating conditions (3.3 V) (continued) Symbol Parameter Conditions Min(1) Max Unit Table 10. Thermal characteristics for LQFP144 package(1) Symbol Parameter Conditions Valu e Unit RJA D Thermal resistance, junction-to-ambient natural convection(2) Single layer board – 1s 44 °C/ W Four layer board – 2s2p 36 RJMA D Thermal resistance, junction-to-ambient forced convection at 200 ft/min Single layer board – 1s 35 °C/ W Four layer board – 2s2p 30 RJB D Thermal resistance junction-to-board(3) —24 °C/ W RJC D Thermal resistance junction-to-case(4) —8 °C/ W JT D Junction-to-package-top natural convection(5) —2 °C/ W |
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