SP1ML datasheet(13/27 Pages) STMICROELECTRONICS

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SP1ML 数据表(PDF) 13 Page - STMicroelectronics

部件名	SP1ML

功能描述	SPIRIT1 868 and 915 MHz low power RF modules with integrated microcontroller

PDF	27 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

13 / 27 page

DocID026906 Rev 4

13/27

SP1ML

Hardware design

2.4

Recommended footprint

Figure 5. Recommended footprint

2.5

Module reflow installation

The SP1ML is a surface mount module supplied on a 16-pin, 4-layer PCB. The final

assembly recommended reflow profile is indicated below, based on IPC/JEDEC JSTD-

020C, July 2004 recommendations.

Table 8. Soldering profile

Profile feature

Lead-free assembly

Average ramp-up rate (TSMAX to TP)

3 °C/sec max

Preheat:

– Temperature min. (TS min.)

– Temperature max. (TS max.)

– Time (ts min. to ts max.)(ts)

150 °C

200 °C

60-100 sec

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