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STF26N60M2 数据表(PDF) 3 Page - STMicroelectronics |
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STF26N60M2 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 15 page ![]() STF26N60M2, STFI26N60M2 Electrical ratings DocID027600 Rev 2 3/15 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±25 V ID (1) Drain current (continuous) at Tcase = 25 °C 20 A Drain current (continuous) at Tcase = 100 °C 13 IDM (2) Drain current (pulsed) 80 A PTOT Total dissipation at Tcase = 25 °C 30 W dv/dt (3) Peak diode recovery voltage slope 15 V/ns dv/dt (4) MOSFET dv/dt ruggedness 50 VISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s; TC = 25 °C) 2.5 kV Tstg Storage temperature -55 to 150 °C Tj Operating junction temperature Notes: (1) Limited by maximum junction temperature. (2) Pulse width is limited by safe operating area. (3) ISD ≤ 20 A, di/dt=400 A/μs; VDS(peak) < V(BR)DSS, VDD = 80% V(BR)DSS. (4) VDS ≤ 480 V. Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case 4.2 °C/W Rthj-amb Thermal resistance junction-ambient 62.5 Table 4: Avalanche characteristics Symbol Parameter Value Unit IAR (1) Avalanche current, repetitive or not repetitive 3.8 A EAR (2) Single pulse avalanche energy 250 mJ Notes: (1) Pulse width limited by Tjmax. (2) starting Tj = 25 °C, ID = IAR, VDD = 50 V. |
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