Recommendation on PCB assembly

ESDALY

8/10

Doc ID 022075 Rev 1

5.3

PCB design preference

1.

To control the solder paste amount, the closed via is recommended instead of open

vias.

2.

The position of tracks and open vias in the solder area should be well balanced. The

symmetrical layout is recommended, in case any tilt phenomena caused by

asymmetrical solder paste amount due to the solder flow away.

5.4

Reflow profile

Figure 14.

ST ECOPACK® recommended soldering reflow profile for PCB mounting

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

60 sec

(90 max)

250

0

50

100

150

200

240

210

180

150

120

90

60

30

300

270

-2 °C/s to

-3 °C/s

-6 °C/s max

240-245 °C

2 - 3 °C/s

0.9 °C/s

Temperature (°C)

Time (s)