Package information

EMIF03-SIM06F3

4/7

DocID024459 Rev 1

2

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 9. Flip-Chip package dimensions

Figure 10. Footprint recommendations

Figure 11. Marking

1140 ± 30 µm

400 ± 30 µm

400 ± 30 µm

1540 ± 30 µm

170 µm

170 µm

Æ 255 ± 40 µm

500 µm ± 50

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

ECOPACK® grade