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L5963 数据表(PDF) 36 Page - STMicroelectronics |
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L5963 数据表(HTML) 36 Page - STMicroelectronics |
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36 / 45 page  Thermal design L5963 36/45 DocID028553 Rev 1 It is possible to improve performance and application thermal behavior, adopting some expedients: Use the bottom layer as heat-sink Inner layer tracks are sunk to the ground plane Use large paths for ground connections, instead of narrow and long paths with sharp corners, and transfer all ground connections to other layers by a proper number of vias Place compensation network very close to the chip to reduce noise Put coils and capacitors close to the pins, and build output path with large and short tracks With the layout configuration shown in Figure 15, a Rth of 13°C/W has been reached. Figure 15. Layout configuration example |
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