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STBB3J 数据表(PDF) 22 Page - STMicroelectronics |
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STBB3J 数据表(HTML) 22 Page - STMicroelectronics |
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22 / 25 page ![]() Package information STBB3J 22/25 DocID025263 Rev 5 Note: The terminal A1 on the bump side is identified by a distinguishing feature (for instance by a circular “clear area” typically 0.1 mm diameter) and/or a missing bump. The terminal A1 on the backside of the product is identified by a distinguishing feature (for instance by a circular “clear area” less than 0.5 mm diameter). Table 8. Flip Chip 20 (2.5 x 1.75 mm) mechanical data Dim. mm Min. Typ. Max. A 0.50 0.55 0.60 A1 0.17 0.20 0.23 A2 0.33 0.35 0.37 b 0.21 0.25 0.29 D 2.485 2.515 2.545 D1 1.6 E 1.731 1.761 1.791 E1 1.2 e0.40 fD 0.447 0.457 0.467 fE 0.27 0.28 0.29 SE 0.20 ccc 0.075 |
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