| 数据搜索系统,热门电子元器件搜索 |
|
STBP112 数据表(PDF) 29 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STBP112 数据表(HTML) 29 Page - STMicroelectronics |
|
29 / 38 page ![]() STBP112 Application information Doc ID 023357 Rev 3 29/38 8.3 PCB layout recommendations ● Input capacitor C1 should be located as close as possible to the STBP112 device. It should be a low-ESR ceramic capacitor. Also the protective resistors RFLT and REN (if used) should be located close to the STBP112 (see Figure 4 on page 9). ● For good thermal performance, it is preferred to couple the STBP112 exposed thermal pads with the PCB ground plane. In most designs, this requires thermal vias between the copper pads on the PCB and the ground plane. |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |