LPS25HB datasheet(17/40 Pages) STMICROELECTRONICS

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LPS25HB

Application hints

Figure 5. LPS25HB electrical connections (top view)

The device power supply must be provided through the VDD line; the power supply

decoupling capacitor C1 (100 nF) must be placed as near as possible to the supply pads of

the device. Depending on the application, an additional capacitor of 4.7 µF could be placed

on VDD line.

The functionality of the device and the measured data outputs are selectable and accessible

through the I²C/SPI interface. When using the I²C, CS must be tied to Vdd_IO.

All the voltage and ground supplies must be present at the same time to have proper

behavior of the IC (refer to Figure 5.). It is possible to remove VDD while maintaining

Vdd_IO without blocking the communication bus, in this condition the measurement chain is

powered off.

5.1

Soldering information

The HLGA package is compliant with the ECOPACK® standard and it is qualified for

soldering heat resistance according to JEDEC J-STD-020.

GND

Vdd_IO

SCL/SPC

VDD

INT_DRDY

GND

Pin indicator

LPS25HB 数据表(PDF) 17 Page - STMicroelectronics