ISO7220A, ISO7220B, ISO7220C, ISO7220M

ISO7221A, ISO7221B, ISO7221C, ISO7221M

www.ti.com

SLLS755N – JULY 2006 – REVISED SEPTEMBER 2015

PARAMETER

TEST CONDITIONS

MIN

TYP MAX

UNIT

Tracking resistance (Comparative

CTI

DIN EN 60112 (VDE 0303-11); IEC 60112

400

V

Tracking Index)

DTI

Distance through the insulation

Minimum Internal Gap (Internal Clearance)

0.008

mm

the barrier tied together creating a two-pin device,

Ω

Isolation resistance

Ω

Barrier capacitance Input to output

1

pF

Input capacitance to ground

1

pF

Table 1. IEC 60664-1 Ratings Table

PARAMETER

TEST CONDITIONS

SPECIFICATION

Basic isolation group

Material group

II

Rated mains voltage

I-IV

Installation classification

Rated mains voltage

I-III

Rated mains voltage

I-II

8.3.3 Regulatory Information

VDE

CSA

UL

Certified according to DIN V VDE V 0884-10 (VDE V

Approved according to CSA Component Acceptance

Recognized under UL 1577 Component

0884-10):2006-12 and DIN EN 61010-1 (VDE 0411-

Notice 5A and IEC 60950-1

Recognition Program

1)

Basic Insulation

Evaluated to CSA 60950-1-07 and IEC 60950-1 (2nd

(1)

working voltages

and

Certificate Number: 40016131

Master Contract Number: 220991

File Number: E181974

(1)

Production tested

8.3.4 Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

124

Safety input, output, or

SOIC-8

mA

supply current

190

Maximum case temperature

SOIC-8

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in Absolute Maximum

Ratings. The power dissipation and junction-to-air thermal impedance of the ISO7220x and ISO7221x devices

installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal

resistance in Thermal Information is that of a device installed in the JESD51-3, Low Effective Thermal

Conductivity Test Board for Leaded Surface Mount Packages and is conservative. The power is the

recommended maximum input voltage times the current. The junction temperature is then the ambient

temperature plus the power times the junction-to-air thermal resistance.

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Product Folder Links: ISO7220A ISO7220B ISO7220C ISO7220M ISO7221A ISO7221B ISO7221C ISO7221M