SPWF01SC datasheet(8/16 Pages) STMICROELECTRONICS

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Module reflow

SPWF01SA, SPWF01SC

8/16

DocID025635 Rev 6

Module reflow

The SPWF01SA and SPWF01SC are surface mount modules with a 6-layer PCB. The

recommended final assembly reflow profiles are indicated below.

The soldering phase must be executed with care: in order to prevent an undesired melting

phenomenon, particular attention must be paid to the setup of the peak temperature.

The following are some suggestions for the temperature profile based on the IPC/JEDEC J-

STD-020C, July 2004 recommendations.

Figure 2. Soldering profile

Table 6. Soldering values

Profile feature

PB-free assembly

Average ramp-up rate (TSMAX to TP)

3 °C/sec max

Preheat:

– Temperature min. (Ts min.)

– Temperature max. (Ts max.)

–Time (Ts min. to Ts max) (ts)

150 °C

200 °C

60-100 sec

Critical zone:

Temperature TL

Time TL

217 °C

60-70 sec

Peak temperature (TP)

240 + 0 °C

Time within 5 °C of actual peak temperature (TP) 10-20 sec

Ramp-down rate

6 °C/sec

Time from 25 °C to peak temperature

8 minutes max.

AM17477v1

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