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74F164ASJ 数据表(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部件名 74F164ASJ
功能描述  Serial-In, Parallel-Out Shift Register
PDF  8 Pages
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制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

74F164ASJ 数据表(HTML) 4 Page - National Semiconductor (TI)

  74F164ASJ Datasheet HTML 1Page - National Semiconductor (TI) 74F164ASJ Datasheet HTML 2Page - National Semiconductor (TI) 74F164ASJ Datasheet HTML 3Page - National Semiconductor (TI) 74F164ASJ Datasheet HTML 4Page - National Semiconductor (TI) 74F164ASJ Datasheet HTML 5Page - National Semiconductor (TI) 74F164ASJ Datasheet HTML 6Page - National Semiconductor (TI) 74F164ASJ Datasheet HTML 7Page - National Semiconductor (TI) 74F164ASJ Datasheet HTML 8Page - National Semiconductor (TI)  
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AC Electrical Characteristics
74F
54F
74F
TA ea25 C
TA VCC e Mil
TA VCC e Com
Symbol
Parameter
VCC ea50V
CL e 50 pF
CL e 50 pF
Units
CL e 50 pF
Min
Typ
Max
Min
Max
Min
Max
fmax
Maximum Clock Frequency
80
120
60
80
MHz
tPLH
Propagation Delay
30
48
75
25
90
30
75
ns
tPHL
CP to Qn
35
50
80
30
85
35
80
tPHL
Propagation Delay
50
70
100
40
125
50
105
ns
MR to Qn
AC Operating Requirements
74F
54F
74F
Symbol
Parameter
TA ea25 C
TA VCC e Mil
TA VCC e Com
Units
VCC ea50V
Min
Max
Min
Max
Min
Max
ts(H)
Setup Time HIGH or LOW
45
55
45
ts(L)
A or B to CP
40
40
40
ns
th(H)
Hold Time HIGH or LOW
10
10
10
th(L)
A or B to CP
10
10
10
tw(H)
CP Pulse Width
40
40
40
ns
tw(L)
HIGH or LOW
70
70
70
tw(L)
MR Pulse Width LOW
40
50
40
ns
trec
Recovery Time
50
65
50
ns
MR to CP
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
164A
S
C
X
Temperature Range Family
Special Variations
74F e Commercial
QB e Military grade device with
54F e Military
environmental and burn-in
processing
Device Type
X e Devices shipped in 13 reel
Package Code
Temperature Range
P e Plastic DIP
C e Commercial (0 Cto a70 C)
D e Ceramic DIP
M e Military (b55 Cto a125 C)
S e Small Outline Package SOIC JEDEC
SJ e Small Outline SOIC EIAJ
L e Package Leadless Chip Carrier (LCC)
F e Flatpak
4



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