ACT4525

- 3 -

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Copyright © 2015 Active-Semi, Inc.



: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may

affect device reliability.

PIN DESCRIPTIONS

PIN

NAME

DESCRIPTION

1

CSP

Voltage Feedback Input. Connect to node of the inductor and output capacitor. CSP,

CSN1 and CSN2 Kevin sensing is recommended.

2

CSN1

Output current sense negative input. Connect to the negative terminal of current

sense resistor for VOUT1.

3

CSN2

Output current sense negative input. Connect to the negative terminal of current

sense resistor for VOUT2.

4

DP

Data Line Positive Input. Connected to D+ of attached portable device data line.

This pin passes 8kV HBM ESD.

5

DM

Data Line Negative Input. Connected to D- of attached portable device data line.

This pin passes 8kV HBM ESD.

6

IN

Power Supply Input. Bypass this pin with a 10μF ceramic capacitor to GND, placed

as close to the IC as possible.

7

SW

Power Switching Output to External Inductor.

8

HSB

High Side Bias Pin. This provides power to the internal high-side MOSFET gate

driver. Connect a 22nF capacitor from HSB pin to SW pin.

9

GND

Ground and Heat Dissipation Pad. Connect this exposed pad to large ground

copper area with copper and vias.

PARAMETER

VALUE

UNIT

IN to GND

-0.3 to 40

V

SW to GND

V

HSB to GND

V

CSP, CSN1, CSN2, DP , DM to GND

-0.3 to +6

V

Junction to Ambient Thermal Resistance

46

°C/W

Operating Junction Temperature

-40 to 150

°C

Storage Junction Temperature

-55 to 150

°C

Lead Temperature (Soldering 10 sec.)

300

°C