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STM32F446ME 数据表(PDF) 186 Page - STMicroelectronics |
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STM32F446ME 数据表(HTML) 186 Page - STMicroelectronics |
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186 / 201 page  Package information STM32F446xC/E 186/201 DocID027107 Rev 5 Figure 77. UFBGA144 - 144-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package recommended footprint ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 112. UFBGA144 recommended PCB design rules (0.50 mm pitch BGA) Dimension Recommended values Pitch 0.50 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm Table 111. UFBGA144 - 144-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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