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STM32F446ME 数据表(PDF) 189 Page - STMicroelectronics |
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STM32F446ME 数据表(HTML) 189 Page - STMicroelectronics |
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189 / 201 page  DocID027107 Rev 5 189/201 STM32F446xC/E Package information 198 Figure 80. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array package recommended footprint F 0.550 0.600 0.650 0.0177 0.0197 0.0217 ddd - - 0.080 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 114. UFBGA144 recommended PCB design rules (0.80 mm pitch BGA) Dimension Recommended values Pitch 0.80 mm Dpad 0.400 mm Dsm 0.550 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm Table 113. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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