Reflow profile

STPTIC-27L2

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DocID028611 Rev 1

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Reflow profile

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

Table 8. Recommended values for soldering reflow

Profile

Value

Typical

Max.

Temperature gradient in preheat (T = 70-180 °C)

0.9 °C/s

3 °C/s

Temperature gradient (T = 200-225 °C)

2 °C/s

3 °C/s

Peak temperature in reflow

240-245 °C

260 °C

Time above 220 °C

60 s

90 s

Temperature gradient in cooling

-2 to -3 °C/s

-6 °C/s

Time from 50 to 220 °C

160 to 220 s