ADP195

Data Sheet

Rev. C | Page 12 of 12

OUTLINE DIMENSIONS

0.05 NOM

COPLANARITY

0.990

0.950

0.910

1.065

1.025

0.985

0.270

0.240

0.210

0.340

0.320

0.300

0.640

0.595

0.550

0.370

0.355

0.340

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

A

1

2

B

SEATING

PLANE

BALL A1

IDENTIFIER

0.50

REF

Figure 30. 4-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-4-4)

Dimensions shown in millimeters

1.70

1.60

1.50

0.425

0.350

0.275

TOP VIEW

6

1

4

3

0.35

0.30

0.25

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.60

0.55

0.50

1.10

1.00

0.90

0.20 REF

0.05 MAX

0.02 NOM

2.00

BSC SQ

0.65 BSC

EXPOSED

PAD

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.175 REF

Figure 31. 6-Lead Lead Frame Chip Scale Package [LFCSP_UD]

2.00 x 2.00 mm Body, Ultra Thin, Dual Lead

(CP-6-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

ADP195ACBZ-R7

−40°C to +85°C

4-Ball Wafer Level Chip Scale Package [WLCSP]

CB-4-4

5Y

ADP195ACPZ-R7

−40°C to +85°C

6-Lead Lead Frame Chip Scale Package [LFCSP_UD]

CP-6-3

LJ6

ADP195-EVALZ

Evaluation Board

ADP195-CP-EVALZ

Evaluation Board

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registered trademarks are the property of their respective owners.

D08679-0-1/12(C)