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74F273SC 数据表(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部件名 74F273SC
功能描述  Octal D Flip-Flop
PDF  8 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

74F273SC 数据表(HTML) 4 Page - National Semiconductor (TI)

  74F273SC Datasheet HTML 1Page - National Semiconductor (TI) 74F273SC Datasheet HTML 2Page - National Semiconductor (TI) 74F273SC Datasheet HTML 3Page - National Semiconductor (TI) 74F273SC Datasheet HTML 4Page - National Semiconductor (TI) 74F273SC Datasheet HTML 5Page - National Semiconductor (TI) 74F273SC Datasheet HTML 6Page - National Semiconductor (TI) 74F273SC Datasheet HTML 7Page - National Semiconductor (TI) 74F273SC Datasheet HTML 8Page - National Semiconductor (TI)  
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AC Electrical Characteristics
74F
54F
74F
TA ea25 C
TA VCC e Mil
TA VCC e Com
Symbol
Parameter
VCC ea50V
CL e 50 pF
CL e 50 pF
Units
CL e 50 pF
Min
Typ
Max
Min
Max
Min
Max
fmax
Maximum Clock Frequency
160
95
130
MHz
tPLH
Propagation Delay
30
70
25
95
25
75
ns
tPHL
Clock to Output
40
900
30
110
35
90
tPLH
Propagation Delay
45
95
30
110
40
100
ns
tPHL
MR to Output
AC Operating Requirements
74F
54F
74F
Symbol
Parameter
TA ea25 C
TA VCC e Mil
TA VCC e Com
Units
VCC ea50V
Min
Max
Min
Max
Min
Max
ts(H)
Setup Time HIGH or LOW
30
35
30
ts(L)
Data to CP
35
40
35
ns
th(H)
Hold Time HIGH or LOW
05
10
05
th(L)
Data to CP
10
10
10
tw(L)
MR Pulse Width LOW
60
40
60
ns
tw(H)
CP Pulse Width
60
50
60
ns
tw(L)
HIGH or LOW
60
50
60
trec
Recovery Time MR to CP
30
45
35
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where a package type and temperature range are
defined as follows
74F
273
S
C
X
Temperature Range Family
Special Variations
74FeCommercial
X e Devices shipped in 13 reels
54FeMilitary
QB e Military grade with environmental
and burn-in processing shipped
Device Type
in tubes
Package Code
Temperature Range
P e Plastic DIP
C e Commercial (0 Cto a70 C)
D e Ceramic DIP
M e Military (b55 Cto a125 C)
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
F e Flatpak
L e Leadless Chip Carrier (LCC)
4



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