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74F534PC 数据表(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部件名 74F534PC
功能描述  Octal D-Type Flip-Flop with TRI-STATE Outputs
PDF  8 Pages
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制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

74F534PC 数据表(HTML) 4 Page - National Semiconductor (TI)

  74F534PC Datasheet HTML 1Page - National Semiconductor (TI) 74F534PC Datasheet HTML 2Page - National Semiconductor (TI) 74F534PC Datasheet HTML 3Page - National Semiconductor (TI) 74F534PC Datasheet HTML 4Page - National Semiconductor (TI) 74F534PC Datasheet HTML 5Page - National Semiconductor (TI) 74F534PC Datasheet HTML 6Page - National Semiconductor (TI) 74F534PC Datasheet HTML 7Page - National Semiconductor (TI) 74F534PC Datasheet HTML 8Page - National Semiconductor (TI)  
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AC Electrical Characteristics
74F
54F
74F
TA ea25 C
TA VCC e Mil
TA VCC e Com
Symbol
Parameter
VCC ea50V
CL e 50 pF
CL e 50 pF
Units
CL e 50 pF
Min
Typ
Max
Min
Max
Min
Max
fmax
Maximum Clock Frequency
100
60
70
MHz
tPLH
Propagation Delay
40
65
85
40
105
40
100
ns
tPHL
CP to On
40
65
85
40
110
40
100
tPZH
Output Enable Time
20
90
115
20
140
20
125
tPZL
20
58
75
20
100
20
85
ns
tPHZ
Output Disable Time
15
53
70
15
80
15
80
tPLZ
15
43
55
15
75
15
65
AC Operating Requirements
74F
54F
74F
Symbol
Parameter
TA ea25 C
TA VCC e Mil
TA VCC e Com
Units
VCC ea50V
Min
Max
Min
Max
Min
Max
ts(H)
Setup Time HIGH or LOW
20
20
20
ts(L)
Dn to CP
20
25
20
ns
th(H)
Hold Time HIGH or LOW
20
20
20
th(L)
Dn to CP
20
25
20
tw(H)
CP Pulse Width
70
70
70
ns
tw(L)
HIGH or LOW
60
60
60
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
534
S
C
X
Temperature Range Family
Special Variations
74F e Commercial
QB e Military grade device with
54F e Military
environmental and burn-in
processing
Device Type
Temperature Range
Package Code
CeCommercial (0 Cto a70 C)
P e Plastic DIP
MeMilitary (b55 Cto a125 C)
D e Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
4



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