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UT699E-CPC 数据表(PDF) 39 Page - Aeroflex Circuit Technology |
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UT699E-CPC 数据表(HTML) 39 Page - Aeroflex Circuit Technology |
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39 / 41 page ![]() 39 Aeroflex Microelectronics Solutions - HiRel 36-00-00-001 Ver. 1.5.0 UT699E LEON 3FT: SMD Package Option Associated Lead Finish (X) 484-CLGA (C) Gold (Y) 484-CCGA (F) Solder Lead Finish: (NOTE: 1) (C) = Gold (F) = Solder Case Outline: (X) = 484-Ceramic Land Grid Array Package (Y) = 484-Ceramic Column Grid Array Screening Level: (Q) = QML Class Q (V) = QML Class V Device Type: (01) = UT699E (Temperature range: -55oC to +105oC) (02) = UT699E Assembled to Aeroflex’s Q+ Flow (Temp range: -55oC to +105oC) Drawing Number: 13237 Total Dose: (R) = 1E5 rad(Si) Federal Stock Class Number: No Options 5962 * 13237 ** * * * Notes: 1. Lead finish is “C” (gold) only for case outlines "X". Lead finish is "F" (solder) only for case outline "Y". |
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