TPS61253_16 datasheet(4/35 Pages) TI1

4 / 35 page

TPS61253, TPS61254, TPS61256, TPS61258, TPS61259, TPS612592

SLVSAG8F – SEPTEMBER 2011 – REVISED MARCH 2016

www.ti.com

Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259 TPS612592

Submit Documentation Feedback

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground terminal.

(3)

Limit the junction temperature to 105°C for continuous operation at maximum output power.

(4)

Limit the junction temperature to 125°C for 5% duty cycle operation.

(5)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is

recommended to operate the device with a maximum junction temperature of 105°C.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

Voltage at VIN(2), VOUT(2), SW(2), EN(2), BP(2)

–0.3

Input current

Continuous average current into SW (3)

1.8

Peak current into SW (4)

3.5

Power dissipation

Internally limited

Temperature

Operating, TA

(5)

–40

°C

Operating virtual junction, TJ

–40

150

Storage, Tstg

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1000

Machine model (MM)

±200

(1)

Up to 1000mA peak output current.

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Input voltage range

TPS61253

2.65(1)

4.85

TPS61254

2.5

4.35

TPS61256

2.5

4.85

TPS61257

2.5

4.15

TPS61258

2.65(1)

4.35

TPS61259

2.65(1)

4.85

TPS612592

2.65(1)

4.85

Minimum resistive load for start-up

TPS6125x

Inductance

0.7

1.0

2.9

µH

Output capacitance

3.5

µF

Ambient temperature

–40

°C

Operating junction temperature

–40

125

°C

TPS61253 数据表(PDF) 4 Page - Texas Instruments

TPS61253 数据表(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35

数据表下载

链接网址

TPS61253 数据表(PDF) 4 Page - Texas Instruments

TPS61253 数据表(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35

数据表 下载

链接网址

数据表下载