4

TPS53353

SLUSAK2C – AUGUST 2011 – REVISED FEBRUARY 2016

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Copyright © 2011–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Input voltage range

VIN (main supply)

–0.3

25

V

VDD

–0.3

28

VBST

–0.3

32

VBST(with respect to LL)

–0.3

7

EN, TRIP, VFB, RF, MODE

–0.3

7

Output voltage range

LL

DC

–2

25

V

Pulse < 20ns, E=5

μJ

–7

27

PGOOD, VREG

–0.3

7

GND

–0.3

0.3

Source/Sink current

VBST

50

mA

–40

85

°C

–40

150

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage range

VIN (main supply)

1.5

15

V

VDD

4.5

25

VBST

4.5

28

VBST(with respect to LL)

4.5

6.5

EN, TRIP, VFB, RF, MODE

–0.1

6.5

Output voltage range

LL

–1

22

V

PGOOD, VREG

–0.1

6.5

–40

125

°C