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M02016

19

CMOS Transimpedance Amplifier with AGC

for Fiber Optic Networks up to 1.25 Gbps

Rev V4

5.0 Die Specification

Figure 5-1.

Bare Die Information

Notes:

Process technology: CMOS, Silicon Nitride passivation

Die thickness: 300 µm

Pad metallization: Aluminium

Die size: 1090 µm x 880 µm

Pad opening (except PINA): 86 µm across flat sides

PINA pad: 70 µm across flat sides (70 µm x 70 µm)

Pad Centers in µm referenced to center of device

Connect backside bias to ground

Pad

Number

Pad

X

Y

1

AGC

-329

-76

-329

-228

3

PINK

-124

-434

4

PINA

124

-434

329

-228

6

MON

329

-76

7DOUT

329

76

DOUTGND

329

228

GND

329

360

GND

255

434

GND

124

434

GND

-124

434

GND

-255

434

GND

-329

360

DOUTGND

-329

228

12

DOUT

-329

76

NOTES:

1.

GND pad. However, bonding one of each pad (if

available) on each side of the die is encouraged

for improved performance in noisy environ-

ments.

2.

Each location is an acceptable bonding location.