2

Date:5/25/04

SP6652 1A, High Efficiency, High Frequency Current Mode PWM Buck Regulator

© Copyright 2004 Sipex Corporation

PARAMETER

MIN

TYP

MAX

UNITS

CONDITIONS

Input Voltage Operating

UVLO

5.5

V

Range

FB Set Voltage

0.735

0.75

0.765

V

FB Input Voltage

-1

0.01

1

Overall FB Accuracy

-4

4

%

FB = COMP

FB Set Voltage (PFM Mode)

0.758

V

Switching Frequency

1

1.2

1.4

MHz

SYNC Tracking Frequency

1

1.2

1.4

MHz

SYNC Input Current

-1

0.01

1

µA

SYNC Logic Threshold Low

0.3

0.6

Ω

SYNC Logic Threshold High

1.7

PWM On-Time Blanking

50

ns

PMOS Switch Resistance

0.25

0.6

Ω

NMOS Switch Resistance

0.25

0.6

Ω

Inductor Current Limit (PWM Mode)

1.2

1.4

1.6

A

Inductor Current Limit (PFM Mode)

300

mA

LX Leakage Current

0.1

3

µASD\=0V

60

100

µA

PFM Mode

2

TBD

nA

PWM Mode

1

500

mA

Shutdown, SD\=0V

102

TBD

1

500

PWM Mode

UVLO

2.6

2.7

2.8

V

Undervoltage Lockout

UVLO hysteresis

6

%

Soft Start Current

1

2

3

SD\, MODE Input Current

-1

0.01

1

µA

SD\, MODE Logic Threshold Low

0.4

V

SD\, MODE Logic Threshold High

1.6

V

Slope Compensation

700

mA/µs

Rising Over-Temperature Trip Point

140

°C

Over-Temperature Hysteresis

14

°C

ERROR AMPLIFIER

Error Amplifier Transconductance

0.5

1

1.5

mS

Error Amplifier Output Impedance

1

mΩ

Error Amplifier Max Sink Current

15

40

60

µA

Error Amplifier Max Source Current

15

40

60

µA

PV

P

LX to P

Storage Temperature .................................................. -65 °C to 150 °C

Operating Temperature ................................................. -40°C to +85°C

Lead Temperature (Soldering, 10 sec) ....................................... 300 °C

ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional operation of the device at

these ratings or any other above those indicated in the operation

sections of the specifications below is not implied. Exposure to

absolute maximum rating conditions for extended periods of time may

affect reliability.

ELECTRICAL CHARACTERISTICS

Note: This thermal Resistance Figure Applies only to a package with the exposed pad soldered to a PCB.

Faliure to do this results in, approximately, a three-fold increase in thermal resistance.