www.seoulsemicon.com

Product Data Sheet

SDWx7F1C

– Chip on Board

 “제품 명 – 제품 군” 을 기입하십시오.

제품 군은 홈페이지 응용분야 분류기준을 참고한다.

(예) SZ5M0WWC9 – High-power LED

21

Font 글씨체

표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body)

– Arial 9pt

 Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….

• Final 승인원: 1.0 부터 시작

• 기존에서 일부 수정: +0.1

• 새로운 Data 추가 /또는 기존 것 삭제: +1.0

 수정일자 표기형식; YYYY-MM-DD

(예) 2013-04-01

Rev3.0, Dec 2, 2015

Handling of Silicone Resin for LEDs

(1) During processing, mechanical stress on the surface should be minimized as much as possible.

Sharp objects of all types should not be used to pierce the sealing compound.

(3) Silicone differs from materials conventionally used for the manufacturing of LEDs.

These conditions must be considered during the handling of such devices. Compared to standard

encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As

mentioned previously, the increased sensitivity to dust requires special care during processing.

In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning

solution must be applied to the surface after the soldering of wire.

(4) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are

used, it must be assured that these solvents do not dissolve the package or resin.

Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.

(5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this

product with acid or sulfur material in sealed space.

(6) Avoid leaving fingerprints on silicone resin parts.

(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs

without a silicone sealant, since the surface can also become scratched.