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STDRG16AB 数据表(PDF) 23 Page - Seoul Semiconductor

部件名 STDRG16AB
功能描述  Applicable for automotive exterior light
PDF  24 Pages
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制造商  SEOUL [Seoul Semiconductor]
网页  http://www.seoulsemicon.com
标志 SEOUL - Seoul Semiconductor

STDRG16AB 数据表(HTML) 23 Page - Seoul Semiconductor

Back Button STDRG16AB Datasheet HTML 16Page - Seoul Semiconductor STDRG16AB Datasheet HTML 17Page - Seoul Semiconductor STDRG16AB Datasheet HTML 18Page - Seoul Semiconductor STDRG16AB Datasheet HTML 19Page - Seoul Semiconductor STDRG16AB Datasheet HTML 20Page - Seoul Semiconductor STDRG16AB Datasheet HTML 21Page - Seoul Semiconductor STDRG16AB Datasheet HTML 22Page - Seoul Semiconductor STDRG16AB Datasheet HTML 23Page - Seoul Semiconductor STDRG16AB Datasheet HTML 24Page - Seoul Semiconductor  
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STDRG16A-T6 Deep Red-B
 “제품 명 – 제품 군” 을 기입하십시오.
제품 군은 홈페이지 응용분야 분류기준을 참고한다.
(예) SZ5M0WWC9 – High-power LED
글씨체는 : Arial, 10pt
 Revision numbering 기준:
• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0
 수정일자 표기형식; YYYY-MM-DD
(예) 2013-04-01
www.seoulsemicon.com
23
Rev3.1, Feb 16, 2016
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires
- This damage usually appears due to the thermal stress produced during the EOS event
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device



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