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TLP240DF 数据表(PDF) 12 Page - Toshiba Semiconductor |
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TLP240DF 数据表(HTML) 12 Page - Toshiba Semiconductor |
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12 / 18 page ![]() TLP240D,TLP240DF 12 19. 19. 19. 19. Ordering Information (Example of Item Name) Ordering Information (Example of Item Name) Ordering Information (Example of Item Name) Ordering Information (Example of Item Name) Item Name TLP240D(F(O TLP240D(LF1,F(O TLP240D(LF5,F(O TLP240D(TP1,F(O TLP240D(TP5,F(O TLP240D(D4,F(O TLP240D(D4,LF1,F(O TLP240D(D4,LF5,F(O TLP240D(D4,TP1,F(O TLP240D(D4,TP5,F(O TLP240DF(F(O TLP240DF(LF4,F(O TLP240DF(TP4,F(O TLP240DF(D4,F(O TLP240DF(D4LF4,F(O TLP240DF(D4TP4,F(O Packaging (Note 1) TH LF1 LF5 TP1 TP5 TH LF1 LF5 TP1 TP5 TH, Wide forming LF4, Wide forming TP4, Wide forming TH, Wide forming LF4, Wide forming TP4, Wide forming VDE Option EN60747-5-5 EN60747-5-5 EN60747-5-5 EN60747-5-5 EN60747-5-5 EN60747-5-5 EN60747-5-5 EN60747-5-5 Packing (MOQ) Magazine (100 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1500 pcs) Tape and reel (1500 pcs) Magazine (100 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1500 pcs) Tape and reel (1500 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1000 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1000 pcs) Note 1: TH: Through-hole, LF/TP: Lead forming for surface mount 2016-01-06 Rev.3.0 ©2016 Toshiba Corporation |
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