| 数据搜索系统,热门电子元器件搜索 |
|
HMC136 数据表(PDF) 4 Page - Hittite Microwave Corporation |
|
|
|||||||||||||||||||||||||||||
HMC136 数据表(HTML) 4 Page - Hittite Microwave Corporation |
|
4 / 4 page ![]() MICROWAVE CORPORATION 6 - 9 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 6 HMC136 GaAs MMIC BI-PHASE MODULATOR, 4 - 8 GHz v01.0300 Outline Drawing Suggested TTL Driver for a Bi-Phase Modulator Notes 1. V AAlternates Between + 2.4 V dc ± I A = 2.4 - 0.6 = ± 5 mA 360 Ohm 2. HCT04 and HC04 are QMOS HEX Inverters. *R 1 =300 to 620 ± 2% Select R1 To Supply ±3 to ±6 mA to the IF Port. 2.2K TTL VCC GND GND VCC HCT04 HC04 .01 uF .01 uF -2.5 Vdc +2.5 Vdc +5 Vdc *R 1 MODULATOR I, Q PORTS HITTITE MODULATOR VA IA V Z = 2V 0.6V NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. 3. BOND PAD SPACING IS .006” CENTER TO CENTER. 4. BACKSIDE METALIZATION: GOLD. 5. BACKSIDE METAL IS GROUND. 6. BOND PAD METALIZATION: GOLD. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. |
|
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |