Automotive NJW4141

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Ver.2016-02-22

THERMAL CHARACTERISTICS

PARAMETER

SYMBOL

VALUE

UNIT

Junction-to-ambient

thermal resistance

ja

125 (*5)

83 (*6)

C/W

Junction-to-Top of package

characterization parameter

jt

13 (*5)

9 (*6)

C/W

(*5): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 2Layers)

(*6): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4Layers),

internal Cu area: 74.2×74.2mm

POWER DISSIPATION vs. AMBIENT TEMPERATURE

0

200

400

600

800

1000

1200

1400

1600

1800

-50

-25

0

25

50

75

100

125

150

Ambient Temperature : Ta (°C)

NJW4141VC3

Power Dissipation vs. Ambient Temperature

(Tj=~150°C)

At on 2 layer PC Board

At on 4 layer PC Board