数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

HMC232LP4 数据表(PDF) 3 Page - Hittite Microwave Corporation

部件名 HMC232LP4
功能描述  GaAs MMIC SPDT NON-REFLECTIVE SWITCH, DC - 12.0 GHz
PDF  6 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  HITTITE [Hittite Microwave Corporation]
网页  http://www.hittite.com
标志 HITTITE - Hittite Microwave Corporation

HMC232LP4 数据表(HTML) 3 Page - Hittite Microwave Corporation

  HMC232LP4 Datasheet HTML 1Page - Hittite Microwave Corporation HMC232LP4 Datasheet HTML 2Page - Hittite Microwave Corporation HMC232LP4 Datasheet HTML 3Page - Hittite Microwave Corporation HMC232LP4 Datasheet HTML 4Page - Hittite Microwave Corporation HMC232LP4 Datasheet HTML 5Page - Hittite Microwave Corporation HMC232LP4 Datasheet HTML 6Page - Hittite Microwave Corporation  
Zoom Inzoom in Zoom Outzoom out
 3 / 6 page
background image
MICROWAVE CORPORATION
14 - 108
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
14
Truth Table
Absolute Maximum Ratings
Control Voltages
Outline Drawing
Control Input
Signal Path State
A
B
RFC to RF1
RFC to RF2
High
Low
ON
OFF
Low
High
OFF
ON
State
Bias Condition
Low
0 to -0.2V @ 10 uA Max.
High
-5V @ 10 uA Typ. to -7V @ 45 uA Typ. (
±0.5 Vdc)
RF Input Power (Vctl= -5V)
(0.5 - 12 GHz)
+30 dBm (@ +50 °C)
Control Voltage Range (A & B)
+1.0V to -7.5 Vdc
Channel Temperature
150 °C
Thermal Resistance (R
TH)
(junction to lead)
94 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Caution: Do not “Hot Switch” power levels greater than
+27 dBm (Vctl = 0/-5 Vdc).
NOTES:
1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY
3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB
LAND PATTERN.
HMC232LP4
GaAs MMIC SPDT NON-REFLECTIVE
SWITCH, DC - 12.0 GHz
v02.0604



Html Pages

1 2 3 4 5 6


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com