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E2DB 数据表(PDF) 1 Page - Microdiode Semiconductor (Shenzhen) Co., Ltd

部件名 E2DB
功能描述  SURFACE MOUNT SUPERFAST RECOVERY RECTIFIER
PDF  2 Pages
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制造商  CHENDA [Microdiode Semiconductor (Shenzhen) Co., Ltd]
网页  http://www.microdiode.com/en
标志 CHENDA - Microdiode Semiconductor (Shenzhen) Co., Ltd

E2DB 数据表(HTML) 1 Page - Microdiode Semiconductor (Shenzhen) Co., Ltd

  E2DB Datasheet HTML 1Page - Microdiode Semiconductor (Shenzhen) Co., Ltd E2DB Datasheet HTML 2Page - Microdiode Semiconductor (Shenzhen) Co., Ltd  
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E2DB
E2GB
ES2ABF THRU ES2JBF
SURFACE MOUNT SUPERFAST RECOVERY RECTIFIER
Reverse Voltage - 50 to 600 Volts
Forward Current - 2.0 Amperes
Note:1.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A
2.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3.P.C.B. mounted with 0.5x0.5
”(12.7x12.7mm) copper pad areas
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
VOLTS
VOLTS
VOLTS
SYMBOLS
UNITS
Amps
Amps
Volts
VRRM
VRMS
VDC
I(AV)
IFSM
VF
2.0
50
1.25
Operating junction and storage temperature range
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at TL=100 C
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage at 2.0A
Maximum DC reverse current
TA=25 C
at rated DC blocking voltage
TA=125 C
IR
5.0
100.0
R
θJA
CJ
TJ,TSTG
65.0
45.0
-55 to +150
pF
C
A
µ
Typical thermal resistance (NOTE 3)
C/W
Typical junction capacitance (NOTE 2)
Maximum reverse recovery time
(NOTE 1)
trr
35
ns
ES2ABF
ES2BBF
ES2DBF
ES2GBF
ES2JBF
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
50
35
50
100
70
100
200
140
200
400
280
400
600
420
600
MDD Catalog Number
Dimensions in inches and (millimeters)
SMBF
Cathode Band
Top View
0.165(4.2)
0.173(4.4)
0.216(5.5)
0.200(5.1)
0.146(3.70)
0.138(3.50)
0.075(1.90)
0.086(2.20)
0.051(1.30)
0.043(1.10)
0.010(0.26)
0.0071(0.18)
0.051(1.30)
0.039(1.0)
FEATURES
For surface mounted applications
Low profile package
Glass Passivated Chip Junction
Superfast reverse recovery time
Lead free in comply with EU RoHS 2011/65/EU diretives
MECHANICAL DATA
Case: JEDEC SMBF molded plastic body
Terminals: leads solderable per MIL-STD-750,
Method 2026
Mounting Position: Any
Weight:57mg/0.002oz
Marking code
E2AB
E2BB
E2JB
1.65
1.0


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