SM2000 datasheet(2/2 Pages) DIOTEC

2 / 2 page

1) Mounted on P.C. board with 25 mm2 copper pads at each terminal

Montage auf Leiterplatte mit 25 mm2 Kupferbelag (Lötpad) an jedem Anschluß

28.02.2002

SM 4001 … SM 4007

SM 513, SM 516, SM 518, SM 2000

Rating for fusing – Grenzlastintegral

t < 10 ms

A = 25

/Ci2t8 A2s

Peak forward pulse current

t = 1ms

A = 85

/CI

FSM

100 A

Max. zulässiger Stromimpuls

Operating junction temperature – Sperrschichttemperatur

– 50...+175

Storage temperature – Lagerungstemperatur

– 50...+175

Characteristics

Kennwerte

Forward voltage – Durchlaßspannung

j = 25

/CI

F = 1 A

< 1.1 V

Leakage current – Sperrstrom

j = 25

/CV

R = VRRM

< 5

j = 100

/CV

R = VRRM

< 50

Thermal resistance junction to ambient air

thA

< 45 K/W 1)

Wärmewiderstand Sperrschicht – umgebende Luft

Thermal resistance junction to terminal

thT

< 10 K/W

Wärmewiderstand Sperrschicht – Kontaktfläche

SM2000 数据表(PDF) 2 Page - Diotec Semiconductor

SM2000 数据表(HTML) 2 Page - Diotec Semiconductor

Html Pages

1 2

数据表下载

链接网址

SM2000 数据表(PDF) 2 Page - Diotec Semiconductor

SM2000 数据表(HTML) 2 Page - Diotec Semiconductor

Html Pages

1 2

数据表 下载

链接网址

数据表下载