Data Sheet

HMC7992

Rev. 0 | Page 13 of 13

OUTLINE DIMENSIONS

3.10

3.00 SQ

2.90

0.30

0.25

0.20

1.92

1.70 SQ

1.48

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

*0.35

0.30

0.25

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.95

0.85

0.75

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

*COMPLIANT WITH JEDEC STANDARDS MO-220-VEED-4

WITH THE EXCEPTION OF PACKAGE EDGE TO LEAD EDGE.

Figure 24. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.85 mm Package Height

(CP-16-38)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

MSL Rating2

Package Description

Package

Option

Branding3

HMC7992LP3DE

–40°C to +105°C

MSL3

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-38

XXXX

7992

HMC7992LP3DETR

–40°C to +105°C

MSL3

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-38

XXXX

7992

EV1HMC7992LP3D

Evaluation Board

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registered trademarks are the property of their respective owners.

D13714-0-1/16(0)