CIRCUIT TECHNIQUES FOR AVOIDING OSCILLATIONS

IN COMPARATOR APPLICATIONS

Feedback to almost any pin of a comparator can result in

oscillation. In addition, when the input signal is a slow volt-

age ramp or sine wave, the comparator may also burst into

oscillation near the crossing point. To avoid oscillation or

instability, PCB layout should be engineered thoughtfully.

Several precautions are recommended:

1. Power supply bypassing is critical, and will improve sta-

bility and transient response. Resistance and inductance

from power supply wires and board traces increase

power supply line impedance. When supply current

changes, the power supply line will move due to its im-

pedance. Large enough supply line shift will cause the

comparator to mis-operate. To avoid problems, a small

bypass capacitor, such as 0.1uF ceramic, should be

placed immediately adjacent to the supply pins. An addi-

tional 6.8µF or greater tantalum capacitor should be

placed at the point where the power supply for the com-

parator is introduced onto the board. These capacitors

act as an energy reservoir and keep the supply imped-

ance low. In dual supply application, a 0.1µF capacitor is

recommended to be placed across V

2. Keep all leads short to reduce stray capacitance and lead

inductance. It will also minimize any unwanted coupling

from any high-level signals (such as the output). The

comparators can easily oscillate if the output lead is

inadvertently allowed to capacitively couple to the inputs

via stray capacitance. This shows up only during the

output voltage transition intervals as the comparator

changes states. Try to avoid a long loop which could act

as an inductor (coil).

3. It is a good practice to use an unbroken ground plane on

a printed circuit board to provide all components with a

low inductive ground connection. Make sure ground

paths are low-impedance where heavier currents are

flowing to avoid ground level shift. Preferably there

should be a ground plane under the component.

4. The output trace should be routed away from inputs. The

ground plane should extend between the output and

inputs to act as a guard. This can be achieved by running

a topside ground plane between the output and inputs. A

typical PCB layout is shown in Figure 5.

5. When the signal source is applied through a resistive

network to one input of the comparator, it is usually

advantageous to connect the other input with a resistor

with the same value, for both DC and AC consideration.

Input traces should be laid out symmetrically if possible.

6. All pins of any unused comparators should be tied to the

negative supply.

micro SMD LIGHT SENSITIVITY

Exposing the micro SMD device to direct sunlight will cause

mis-operation of the device. Light sources such as Halogen

lamps can also affect electrical performance if brought near

to the device. The wavelengths, which have the most detri-

mental effect, are reds and infrareds.

micro SMD MOUNTING

The micro SMD package requires specific mounting tech-

niques, which are detailed in National Semiconductor Appli-

cation Note AN-1112.

LMV7272 micro SMD to DIP Conversion Board

To facilitate characterization and testing, a micro SMD to DIP

conversion board, LMV7272TLCONV, is available. It is a

2-layer board, with the LMV7272 mounted on the bottom

layer, and a capacitor (C1, between the positive and nega-

tive supplies) added to the top layer.

20064060

LMV7272TLCONV Diagram

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20064043

FIGURE 4. Non-Inverting Comparator with Hysteresis

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FIGURE 5. Typical PCB Layout

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