2N6402 datasheet(2/8 Pages) ONSEMI

2 / 8 page

2N6400 Series

http://onsemi.com

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction to Case

RθJC

1.5

°C/W

Maximum Lead Temperature for Soldering Purposes 1/8

″ from Case for 10 Seconds

260

°C

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)

Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS

*Peak Repetitive Forward or Reverse Blocking Current

(VAK = Rated VDRM or VRRM, Gate Open)

TJ = 25°C

TJ = 125°C

IDRM, IRRM

–

2.0

µA

ON CHARACTERISTICS

*Peak Forward On–State Voltage

(ITM = 32 A Peak, Pulse Width ≤ 1 ms, Duty Cycle ≤ 2%)

VTM

–

1.7

Volts

*Gate Trigger Current (Continuous dc)

TC = 25°C

(VD = 12 Vdc, RL = 100 Ohms)

TC = –40°C

IGT

–

9.0

–

*Gate Trigger Voltage (Continuous dc)

(VD = 12 Vdc, RL = 100 Ohms)

TC = 25°C

TC = –40°C

VGT

–

0.7

–

1.5

2.5

Volts

Gate Non–Trigger Voltage

(VD = 12 Vdc, RL = 100 Ohms)

TC = +125°C

VGD

0.2

–

Volts

*Holding Current

TC = 25°C

(VD = 12 Vdc, Initiating Current = 200 mA,

Gate Open)

*TC = –40°C

–

Turn-On Time

(ITM = 16 A, IGT = 40 mAdc, VD = Rated VDRM)

tgt

–

1.0

–

µs

Turn-Off Time

(ITM = 16 A, IR = 16 A, VD = Rated VDRM)TC = 25°C

TJ = +125°C

–

µs

DYNAMIC CHARACTERISTICS

Critical Rate–of–Rise of Off-State Voltage

(VD = Rated VDRM, Exponential Waveform)

TJ = +125°C

dv/dt

–

µs

*Indicates JEDEC Registered Data.

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