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B57504K0103A009 数据表(PDF) 5 Page - TDK Electronics

部件名 B57504K0103A009
功能描述  Probe assemblies
PDF  9 Pages
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制造商  TDK [TDK Electronics]
网页  http://www.tdk.com
标志 TDK - TDK Electronics

B57504K0103A009 数据表(HTML) 5 Page - TDK Electronics

  B57504K0103A009 Datasheet HTML 1Page - TDK Electronics B57504K0103A009 Datasheet HTML 2Page - TDK Electronics B57504K0103A009 Datasheet HTML 3Page - TDK Electronics B57504K0103A009 Datasheet HTML 4Page - TDK Electronics B57504K0103A009 Datasheet HTML 5Page - TDK Electronics B57504K0103A009 Datasheet HTML 6Page - TDK Electronics B57504K0103A009 Datasheet HTML 7Page - TDK Electronics B57504K0103A009 Datasheet HTML 8Page - TDK Electronics B57504K0103A009 Datasheet HTML 9Page - TDK Electronics  
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Cautions and warnings
See "Important notes".
Storage
Store thermistors only in original packaging. Do not open the package prior to storage.
Storage conditions in original packaging: storage temperature
25
°C ... +45 °C, relative
humidity
≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is
inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the
packing material may be deformed or components may stick together, causing problems during
mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).
Use the components as soon as possible after opening the factory seals, i.e. the
polyvinyl-sealed packages.
Solder thermistors within the time specified after shipment from EPCOS.
For leaded components this is 24 months, for SMD components with nickel barrier termination
12 months, for SMD components with AgPd termination 6 months.
Handling
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused
during handling of NTCs.
Do not touch components with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
Bending / twisting leads
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from
the component head or housing. When bending ensure the wire is mechanically relieved at the
component head or housing. The bending radius should be at least 0.75 mm.
Twisting (torsion) by 180
° of a lead bent by 90° is permissible at 6 mm from the bottom of the
thermistor body.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Temperature measurement
B57504K
Probe assemblies
K504
Page 5 of 9
Please read Cautions and warnings and
Important notes at the end of this document.



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