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AM29F002B 数据表(PDF) 40 Page - Advanced Micro Devices

部件名 AM29F002B
功能描述  2 Megabit (256 K x 8-Bit) CMOS 5.0 Volt-only Boot Sector Flash Memory
PDF  40 Pages
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制造商  AMD [Advanced Micro Devices]
网页  http://www.amd.com
标志 AMD - Advanced Micro Devices

AM29F002B 数据表(HTML) 40 Page - Advanced Micro Devices

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November 28, 2000
Am29F002B/Am29F002NB
39
REVISION SUMMARY
Revision A (July 1998)
Initial release.
Revision B (January 1999)
Distinctive Characteristics
Added:
■ 20-year data retention at 125
°C
— Reliable operation for the life of the system
AC Characterisitics—Read Operations Table
tEHQZ, tGHQZ: Changed the 55 speed option to 15 ns
from 20 ns
AC Characteristics—Erase/Program Operations
tWLAX: Changed the 90 speed option to 45 ns from 50 ns.
tDVWH: Changed the 55 speed option to 25 ns from 30 ns.
tWLWH: changed the 55 speed option to 30 ns from 35 ns.
AC Characteristics—Alternate CE# Controlled
Erase/Program Operations
tDVEH: Changed the 55 speed option to 25 ns from 30 ns.
tELEH: Changed the 55 speed option to 30 ns from 35 ns.
tELAX: Changed the 90 speed option to 45 ns from 50 ns.
DC Characteristics—TTL/NMOS Compatible
ICC1, ICC2, ICC3, ICC4: Added Note 2 “Maximum ICC
specifications are tested with VCC = VCCmax”.
DC Characteristics—CMOS Compatible
ICC1, ICC2, ICC3, ICC4: Added Note 2 “Maximum ICC
specifications are tested with VCC = VCCmax”.
Revision C (November 12, 1999)
AC Characteristics—Figure 11. Program
Operations Timing and Figure 12. Chip/Sector
Erase Operations
Deleted tGHWL and changed OE# waveform to start at
high.
Physical Dimensions
Replaced figures with more detailed illustrations.
Revision D (November 28, 2000)
Global
Added table of contents.
Ordering Information
Deleted burn-in option.
Table 5, Command Definitions
In Note 4, changed the lower address bit of don’t care
range to A11.
Trademarks
Copyright © 2000 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies



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