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LM4906 数据表(PDF) 13 Page - National Semiconductor (TI) |
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LM4906 数据表(HTML) 13 Page - National Semiconductor (TI) |
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13 / 15 page ![]() Application Information (Continued) Mono LM4906 Reference Design Boards Bill of Material Part Description Quantity Reference Designator LM4906 Audio Amplifier 1 U1 Tantalum Capcitor, 1µF 1 C1 Ceramic Capacitor, 0.39µF 1 C2 Jumper Header Vertical Mount 2X1 0.100“ spacing 5 J1, J2, Input, Output, V DD PCB LAYOUT GUIDELINES This section provides practical guidelines for mixed signal PCB layout that involves various digital/analog power and ground traces. Designers should note that these are only "rule-of-thumb" recommendations and the actual results will depend heavily on the final layout. GENERAL MIXED SIGNAL LAYOUT RECOMMENDATION Power and Ground Circuits For 2 layer mixed signal design, it is important to isolate the digital power and ground trace paths from the analog power and ground trace paths. Star trace routing techniques (bring- ing individual traces back to a central point rather than daisy chaining traces together in a serial manner) can have a major impact on low level signal performance. Star trace routing refers to using individual traces to feed power and ground to each circuit or even device. This technique will require a greater amount of design time but will not increase the final price of the board. The only extra parts required will be some jumpers. Single-Point Power / Ground Connections The analog power traces should be connected to the digital traces through a single point (link). A "Pi-filter" can be helpful in minimizing High Frequency noise coupling between the analog and digital sections. It is further recommended to put digital and analog power traces over the corresponding digi- tal and analog ground traces to minimize noise coupling. Placement of Digital and Analog Components All digital components and high-speed digital signal traces should be located as far away as possible from analog components and circuit traces. Avoiding Typical Design / Layout Problems Avoid ground loops or running digital and analog traces parallel to each other (side-by-side) on the same PCB layer. When traces must cross over each other do it at 90 degrees. Running digital and analog traces at 90 degrees to each other from the top to the bottom side as much as possible will minimize capacitive noise coupling and cross talk. www.national.com 13 |
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