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IXDF602PI 数据表(PDF) 12 Page - IXYS Corporation |
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IXDF602PI 数据表(HTML) 12 Page - IXYS Corporation |
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12 / 13 page ![]() INTEGRATED CIRCUITS DIVISION IXD_602 12 www.ixysic.com R06 5.4.3 Tape & Reel Information for SI and SIA Packages 5.4.4 PI (8-Pin DIP) Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K 0= 2.10 (0.083) W=12.00 (0.472) B 0=5.30 (0.209) User Direction of Feed A 0=6.50 (0.256) P=8.00 (0.315) Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7.239 TYP. (0.285) 7.620 ± 0.254 (0.300 ± 0.010) 4.064 TYP (0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) |
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