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IXDD609PI 数据表(PDF) 12 Page - IXYS Corporation |
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IXDD609PI 数据表(HTML) 12 Page - IXYS Corporation |
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12 / 14 page ![]() INTEGRATED CIRCUITS DIVISION IXD_609 12 www.ixysic.com R06 5.4.3 Tape & Reel Information for SI and SIA Packages 5.4.4 YI (5-Pin TO-263) Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K 0= 2.10 (0.083) W=12.00 (0.472) B 0=5.30 (0.209) User Direction of Feed A 0=6.50 (0.256) P=8.00 (0.315) DIMENSIONS mm MIN / mm MAX (inches MIN / inches / MAX) NOTES: 1. All metal surfaces are solder-plated except trimmed area. 2. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally. 8.636 / 9.144 (0.340 / 0.360) 14.605 / 15.875 (0.575 / 0.625) 9.652 / 10.312 (0.380 / 0.406) 1.70 BSC (0.067 BSC) 1 2 3 4 5 0.737 / 0.889 (0.029 / 0.035) 1.143 / 1.651 (0.045 / 0.065) 4.318 / 4.597 (0.170 / 0.181) 1.143 / 1.397 (0.045 / 0.055) 2.286 / 2.794 (0.090 / 0.110) 0º - 8º 6.858 MIN (0.270 MIN) 6.223 MIN (0.245 MIN) 6 3.95 (0.156) 3.65 (0.144) 6.35 (0.250) 1.00 (0.039) 1.70 (0.067) 10.40 (0.409) 9.30 (0.366) Recommended PCB Pattern 0.000 / 0.305 (0.000 / 0.012) |
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