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CPC1709 数据表(PDF) 1 Page - IXYS Corporation

部件名 CPC1709
功能描述  Low Drive Power Requirements
PDF  7 Pages
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制造商  IXYS [IXYS Corporation]
网页  http://www.ixys.com
标志 IXYS - IXYS Corporation

CPC1709 数据表(HTML) 1 Page - IXYS Corporation

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INTEGRATED CIRCUITS DIVISION
DS-CPC1709-R08
www.ixysic.com
1
Characteristics
Features
22.8A
DC Load Current with 5°C/W Heat Sink
Low 0.05
 On-Resistance
60V
P Blocking Voltage
2500V
rms Input/Output Isolation
Low Thermal Resistance:
JC = 0.3 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL 508 Certified Component: File E69938
CSA Certified Component: Certificate 1172007
Pin Configuration
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1709 single-pole
normally open (1-Form-A) DC Solid State Power
Relay employs optically coupled MOSFET technology
to provide 2500Vrms of input to output isolation.
The output, constructed with an efficient MOSFET
switch and photovoltaic die, uses IXYS Integrated
Circuits Division’s patented OptoMOS architecture
while the input, a highly efficient infrared LED,
provides the optically coupled control. The
combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500Vrms isolation but also very low junction-to-case
thermal resistance (0.3 °C/W).
Ordering Information
Switching Characteristics
Parameter
Rating
Units
Blocking Voltage
60
VP
Load Current, TA=25°C:
With 5°C/W Heat Sink
22.8
ADC
No Heat Sink
9
On-Resistance (max)
0.05
Thermal Resistance,
Junction-to-Case,
JC
0.3
°C/W
12
3
4
+-
-
+
Part
Description
CPC1709J
ISOPLUS-264 Package (25 per tube)
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
CPC1709
60V Single-Pole, Normally Open
DC-Only Power Relay


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