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CPC7583BA 数据表(PDF) 17 Page - IXYS Corporation |
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CPC7583BA 数据表(HTML) 17 Page - IXYS Corporation |
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17 / 19 page ![]() INTEGRATED CIRCUITS DIVISION CPC7583 R07 www.ixysic.com 17 For power induction or power-cross fault conditions, the positive cycle of the transient is clamped to a diode drop above ground and the fault current directed to ground. The negative cycle of the transient will cause the SCR to conduct when the voltage exceeds the VBAT reference voltage by two to four volts, steering the fault current to ground. 2.9.2 Current Limiting function If a lightning strike transient occurs when the device is in the talk state, the current is passed along the line to the integrated protection circuitry and restricted by the dynamic current limit response of the active switches. During the talk state when a 1000V 10x1000 S pulse (GR-1089-CORE lightning) is applied to the line though a properly clamped external protector, the current into TLINE or RLINE will be a pulse with a typical magnitude of 2.5 A and a duration of less than 0.5 s. If a power-cross fault occurs with the device in the talk state, the current is passed though break switches SW1 and SW2 on to the integrated protection circuit and is limited by the dynamic DC current limit response of the two break switches. The DC current limit, specified over temperature, is between 80 mA and 425 mA, and the circuitry has a negative temperature coefficient. As a result, if the device is subjected to extended heating due to power cross fault, the measured current at TLINE or RLINE will decrease as the device temperature increases. If the device temperature rises sufficiently, the temperature shutdown mechanism will activate and the device will enter the all-off state. 2.10 Temperature Shutdown The thermal shutdown mechanism will activate when the device temperature reaches a minimum of 110° C, placing the device in the all-off state regardless of logic input. During thermal shutdown mode, the voltage out of the TSD pin will read 0 V. Normal output of TSD is VDD. If presented with a short duration transient such as a lightning event, the thermal shutdown feature will typically not activate. But in an extended power-cross transient, the device temperature will rise and the thermal shutdown will activate forcing the switches to the all-off state. At this point the current measured into TLINE or RLINE will drop to zero. Once the device enters thermal shutdown it will remain in the all-off state until the temperature of the device drops below the deactivation level of the thermal shutdown circuit. This will permit the device to return to normal operation. If the transient has not passed, current will flow up to the value allowed by the dynamic DC current limiting of the switches and heating will begin again, reactivating the thermal shutdown mechanism. This cycle of entering and exiting the thermal shutdown mode will continue as long as the fault condition persists. If the magnitude of the fault condition is great enough, the external secondary protector could activate and shunt all current to ground. 2.11 External Protection Elements The CPC7583 requires only over-voltage secondary protection on the loop side of the device. The integrated protection feature described above negates the need for additional protection on the SLIC side. The secondary protector must limit voltage transients to levels that do not exceed the breakdown voltage or input-output isolation barrier of the CPC7583. A foldback or crowbar type protector is recommended to minimize stresses on the CPC7583. Consult IXYS Integrated Circuits Division’s application note, AN-100, “Designing Surge and Power Fault Protection Circuits for Solid State Subscriber Line Interfaces” for equations related to the specifications of external secondary protectors, fused resistors and PTCs. |
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