IX21844

R01

www.ixysic.com

13

3.5 Mechanical Dimensions

3.5.1 IX21844G 14-Pin DIP Package

3.5.2 IX21844N 14-Pin SOIC (Narrow Body) Package

NOTES:

1. JEDEC outline: MS-001 AA.

2. This dimension does not include mold flash or

protrusions. Mold flash or protrusions shall not

exceed 0.254 (0.010).

3. Measured at the lead tips with the leads

unconstrained.

4. Pointed or rounded lead tips are preferred to

ease insertion.

5. Distance between leads including dam bar

protrusions to be 0.127 (0.005).

6. Datum plane H coincident with the bottom of

lead where lead exits body.

DIMENSIONS

(min / max)

mm

(inches)

Pin 1

8.509 / 9.525

(0.335 / 0.375)

See Note 3

7.62 BSC

(0.300 BSC)

18.542 / 19.050

(0.730 / 0.750)

See Note 2

2.921 / 3.810

(0.115 / 0.150)

0.381 min

(0.015 min)

0.457 typ

(0.018 typ)

2.542

(0.100)

3.175 / 3.429

(0.125 / 0.135)

1.524 typ

(0.06 typ)

6.223 / 6.477

(0.245 / 0.255)

See Note 2

PCB Hole Pattern

7.62

(0.300)

2.54

(0.100)

1.35

(0.053)

0.85

(0.0335)

Hole Size =

5.334 max

(0.210 max)

H

Seating Plane

0º / 15º

NOTES:

1. JEDEC outline: MS-012 AB Rev F. (reference)

2. Molded package dimension do not include mold flash,

protrusions, or gate burrs. Mold flash, protrusions, and

gate burrs shall not exceed 0.15 (0.006) per side.

3. Lead dimensions do not include inter-lead flash or

protrusions. Inter-lead flash and protrusions shall not

exceed 0.25 (0.010) per side.

DIMENSIONS

min / max

mm

(inches)

PCB Pattern

5.98 / 6.02

(0.235 / 0.237)

8.65 BSC

(0.341 BSC)

See Note 2

0.4 / 0.95

(0.016 / 0.037)

1.27 TYP

(0.05 TYP)

0.15 / 0.25

(0.006 / 0.010)

0.31 / 0.51

(0.012 / 0.020)

3.90 BSC

(0.154 BSC)

See Note 3

1.25 min

(0.049 min)

0.10 / 0.25

(0.004 / 0.010)

1.75 max

(0.069 max)

0º / 8º

5.30

(0.209)

1.50

(0.059)

0.60

(0.024)

1.27

(0.05)