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ISD2575 数据表(PDF) 39 Page - Winbond |
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ISD2575 数据表(HTML) 39 Page - Winbond |
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39 / 42 page ![]() ISD2560/75/90/120 Publication Release Date: May 2003 - 39 - Revision 1.0 ISD2560/75/90/120 PRODUCT PAD DESIGNATIONS (with respect to die center) Pad Pad Name X Axis (µm) Y Axis (µm) A0 Address 0 -897.9 3135.2 A1 Address 1 -1115.4 3135.2 A2 Address 2 -1331.0 3135.2 A3 Address 3 -1544.0 3135.2 A4 Address 4 -1640.4 2888.9 A5 Address 5 -1698.2 2671.0 A6 Address 6 -1698.2 2441.5 A7 Address 7 -1731.2 -2583.2 A8 Address 8 -1731.2 -2768.4 A9 Address 9 -1731.2 -3050.8 AUX IN Auxiliary Input -1410.2 -3115.7 VSSD VSS Digital Power Supply -1112.4 -3096.5 VSSA VSS Analog Power Supply -408.2 -3138.9 SP+ Speaker Output + -46.65 -3068.4 SP- Speaker Output - 386.1 -3068.4 VCCA VCC Analog Power Supply 746.9 -3110.8 MIC Microphone Input 1101.2 -3146.0 MIC REF Microphone Reference 1294.7 -3146.0 AGC Automatic Gain Control 1666.4 -3130.3 ANA IN Analog Input 1728.6 -2654.0 ANA OUT Analog Output 1700.9 -2411.0 OVF Overflow Output 1674.6 2489.5 CE Chip Enable Input 1726.7 2824.4 PD Power Down Input 1730.5 3094.0 EOM End of Message 1341.2 3122.1 XCLK No Connect (optional) 986.5 3160.7 P/ R Playback/Record 807.2 3163.4 VCCD VCC Digital Power Supply 544.4 3159.6 |
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