STPAC02F1

4/5

0.2

0.25

0.3

0.35

0.4

-10

-9

-8

-7

-6

-5

-4

-3

-2

-1

0

900MHz

1750MHz

Pin (dBm)

Vout @ 25ºC (Vdc)

Fig. 7: STPAC02 Output voltage at Low RF power.

2

7

12

17

22

-10

-8

-6

-4

-2

0

2

7

12

17

22

-10

-8

-6

-4

-2

0

Pin (dBm)

Sensitivity(mV/dB)

Fig. 8: Power detector sensitivity at low RF power.

1.57mm ± 50µm

315µm ± 50

500µm ± 50

650µm ± 65

PACKAGE MECHANICAL DATA

365

240

x

y

x

w

x

w

Dot, ST logo

xxx = marking

yww = datecode

(y = year

ww = week)

All dimensions in µm

E

MARKING

Copper pad Diameter :

250µm recommended , 300µm max

Solder stencil opening : 330µm

Solder mask opening recommendation :

340µm min for 300µm copper pad diameter

FOOT PRINT RECOMMENDATIONS