CS5211

http://onsemi.com

2

COMP

GATE(H)

GATE(L)

PGND

IS–

CS5211

2.5 V/8.0 A

51 k

0.1

µF

LGND

100

µF/10 V × 3

0.1

µF

SENSE+

4.7 k

1.0 k

1.0%

2.9

µH

5.0 V

IS+

SENSE–

+

+

100

µF/10 V × 2

SGND

1.0%

0.1

µF

0.1

µF

10

BST

4.7 k

Figure 1. Application Diagram, 5.0 V to 2.5 V/8.0 A Converter with Differential Remote Sense

10

1.5 k

0.1

µF

Return

680 pF

MAXIMUM RATINGS*

Rating

Value

Unit

150

°C

Lead Temperature Soldering:

Reflow: (SMD styles only) (Note 1)

230 peak

°C

–65 to +150

°C

Package Thermal Resistance:

30

125

°C/W

°C/W

ESD Susceptibility (Human Body Model)

2.0

kV

JEDEC Moisture Sensitivity

1.0

–

1. 60 second maximum above 183

°C.

*The maximum package power dissipation must be observed.

MAXIMUM RATINGS

Pin Name

Pin Symbol

IC Power Input

16 V

–0.3 V

N/A

50 mA DC

Power input for the low side driver

16 V

–0.3 V

N/A

1.5 A Peak, 200 mA DC

Power Supply input for the high

side driver

BST

20 V

–0.3 V

N/A

1.5 A Peak, 200 mA DC

Compensation Capacitor

COMP

6.0 V

–0.3 V

1.0 mA

1.0 mA

Voltage Feedback Input

6.0 V

–0.3 V

1.0 mA

1.0 mA

Oscillator Resistor

6.0 V

–0.3 V

1.0 mA

1.0 mA